Atıf Formatları
Modelling and Simulation of Conjugate Heat Transfer in Comsol Multiphysics for Electronic Chip Cooling
  • IEEE
  • ACM
  • APA
  • Chicago
  • MLA
  • Harvard
  • BibTeX

M. U. Badak Et Al. , "Modelling and Simulation of Conjugate Heat Transfer in Comsol Multiphysics for Electronic Chip Cooling," The International Iğdır Symposium (IĞDIRSEMP2017) , Iğdır, Turkey, pp.1, 2017

Badak, M. U. Et Al. 2017. Modelling and Simulation of Conjugate Heat Transfer in Comsol Multiphysics for Electronic Chip Cooling. The International Iğdır Symposium (IĞDIRSEMP2017) , (Iğdır, Turkey), 1.

Badak, M. U., Aktaş, N., & Mert, S. O., (2017). Modelling and Simulation of Conjugate Heat Transfer in Comsol Multiphysics for Electronic Chip Cooling . The International Iğdır Symposium (IĞDIRSEMP2017) (pp.1). Iğdır, Turkey

Badak, Mehmet, Nahit Aktaş, And Suha Orçun Mert. "Modelling and Simulation of Conjugate Heat Transfer in Comsol Multiphysics for Electronic Chip Cooling," The International Iğdır Symposium (IĞDIRSEMP2017), Iğdır, Turkey, 2017

Badak, Mehmet U. Et Al. "Modelling and Simulation of Conjugate Heat Transfer in Comsol Multiphysics for Electronic Chip Cooling." The International Iğdır Symposium (IĞDIRSEMP2017) , Iğdır, Turkey, pp.1, 2017

Badak, M. U. Aktaş, N. And Mert, S. O. (2017) . "Modelling and Simulation of Conjugate Heat Transfer in Comsol Multiphysics for Electronic Chip Cooling." The International Iğdır Symposium (IĞDIRSEMP2017) , Iğdır, Turkey, p.1.

@conferencepaper{conferencepaper, author={Mehmet Utku Badak Et Al. }, title={Modelling and Simulation of Conjugate Heat Transfer in Comsol Multiphysics for Electronic Chip Cooling}, congress name={The International Iğdır Symposium (IĞDIRSEMP2017)}, city={Iğdır}, country={Turkey}, year={2017}, pages={1} }